Texas Instruments breaks ground on new 12-inch wafer fabrication facility

　　According to official news from Texas Instruments, on May 19, Texas Instruments (TI) announced that its new 12-inch semiconductor wafer manufacturing base in Sherman, Texas officially broke ground.

　　It is reported that the investment of this project is about 30 billion US dollars, and it is planned to build four factories to meet the long-term market demand. These new factories will manufacture tens of millions of analog and embedded processing chips per day for a wide variety of electronic products in the global market.

　　It is reported that the first factory in the Sherman wafer fabrication base is expected to start production in 2025. The wafer fabrication base will join the existing 12-inch wafer fabrication facilities of Texas Instruments, including DMOS6 in Dallas, Texas; located in Texas RFAB1 in Richardson and RFAB2, which is nearing completion and expected to start production in the second half of 2022; and LFAB, in Lehi, Utah, expected to start production in early 2023.

　　In addition, Texas Instruments' manufacturing base in Chengdu, China integrates wafer fabrication, packaging, testing, bump processing and wafer testing, and is currently expanding a second packaging/testing facility.

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