12 semiconductor companies set up ‘JOINT2’ alliance

(The picture comes from the Internet)

　　According to Japanese media reports, a total of 12 companies in Japan have formed the "JOINT2" alliance to jointly develop a new generation of materials used in semiconductor production.

　　According to the report, "JOINT2" is led by Showa Denko, a major semiconductor material company, and includes 12 semiconductor companies including material manufacturers and equipment manufacturers. It plans to accelerate the development of advanced semiconductor packaging materials through comprehensive joint research.

　　The alliance was formed to structure manufacturing processes by integrating technologies between suppliers to quickly deliver the materials customers require.

　　In recent years, major semiconductor manufacturers such as TSMC and Intel have been focusing on the development of 3D packaging technology, but the increased technical complexity and the long development and evaluation process have become a problem.

　　The companies participating in the alliance will build a new situation of joint development. In this way, the time for evaluating the physical properties of test products can be shortened by half. Hidenori Abe, director of Showa Denko Materials, said that by creating products and processes in partnership with multiple relevant material suppliers, "rework can be reduced and development and evaluation can be accelerated."

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