SK Hynix will build a chip packaging plant in the United States, and it is expected to start production in 2025 at the earliest

（The picture comes from the Internet）

　　SK Hynix plans to build a new advanced chip packaging plant in the U.S., which is expected to be located in the first half of 2023, people familiar with the matter said.

　　The plant is expected to cost "billions of dollars" to achieve mass production in 2025-2026, with plans to hire 1,000 workers, according to the sources. In addition, the plant will be used to package SK Hynix's own memory chips and logic chips designed by other U.S. companies for machine learning and artificial intelligence applications.

　　In a statement to Reuters, SK Hynix did not specify new details of the plant, but said that of the recently announced investment, "$15 billion will be invested in advanced packaging and other semiconductor-related R&D, details not yet available. Sure."

　　Earlier, SK Group said it would invest an additional $22 billion in the United States. Including the previously announced US$7 billion investment plan in the US, the total investment will reach US$29 billion.

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