Former TSMC executive joins Intel

（The picture comes from the Internet）

　　Market sources pointed out that Suk Lee, who was in charge of TSMC's Open Innovation Platform (OIP), officially joined Intel's camp after leaving TSMC not long ago. After joining Intel, Suk Lee's title is Ecosystem Development VP.

　　It is understood that Suk Lee, a Korean national, has worked for TSMC for many years. From his early work in TSMC's US branch to his return to TSMC's Hsinchu headquarters, the open innovation platform business has been the main work he has been responsible for.

　　According to TSMC's description on the official website, the open innovation platform is a complete design technology framework, covering all key integrated circuit design areas, effectively reducing various obstacles that may be encountered during design, and improving the chance of success in the first production. The open innovation platform mainly combines the semiconductor design industry, TSMC's design ecosystem partners, IP intellectual property, design applications, design for manufacturability services, process technology, and back-end packaging and testing services. It can be seen that the importance of the open innovation platform for both TSMC and customers.

　　In fact, just before Suk Lee was rumored to join the Intel team and serve as vice president of ecosystem development business, Intel's foundry service (IFS) also recently announced that it would establish the IFS Cloud Alliance to achieve security in the cloud. The design environment improves the design efficiency of foundry customers and accelerates time-to-market by leveraging massive on-demand computing. Initial members include Amazon Web Services and Microsoft Azure, as well as major electronic design automation (EDA) players.

　　Intel emphasized that through this cloud alliance, IFS is expected to work with partners to ensure that EDA tools are optimized for cloud scalability benefits while meeting Intel's Process Design Kit (PDK) requirements. By partnering with leading EDA vendors such as Ansys, Cadence, Siemens EDA and Synopsys, it provides a secure and scalable path for customers to use the EDA tools and processes of their choice in cloud environments. The result is a foundry platform that provides hardware-on-demand, allowing designers to accommodate larger workloads with better resource management, time-to-market and quality of results.

　　It can be seen from the above statement of Intel that Intel, which has returned to the foundry market, is to follow the example of TSMC's open innovation platform architecture to establish a complete foundry ecosystem, and to further develop its future with TSMC. further competition. Now, if TSMC is recruited for the top management of the open innovation platform, how much benefit will it bring in the future, and what kind of impact it will have on TSMC remains to be seen in the future.

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